Mini High Vacuum Benchtop Magnetron Sputtering System Equipment

High Vacuum Benchtop Magnetron Sputtering System Equipment

TMAX-BY-JS04-Various weakly magnetic targets

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Specification

Category	Specification
Target Material	Various weakly magnetic targets
Target Size	Ø60-80mm (weakly magnetic targets)
Control Mode	Manual operation
Chamber	Borosilicate glass, Ø180mm × H240mm
Sample Stage	Ø180mm (compatible with Ø80mm stage)
Sputtering Gas	Supports multiple gases (e.g., Ar)
Vacuum System	- Turbo molecular pump (80L/s)   - Two-stage high-performance vacuum pump
Sputtering Targets	- Standard: Au (60mm × 0.1mm)   - Optional: Ag, Pt (customizable)
Sputtering Current	0-500A
Ultimate Vacuum	5×10⁻⁴ Pa
Operating Voltage	220V, 50Hz

Key Features & Applications

Features:

✔ High Deposition Rate – Enhanced plasma confinement for efficient material utilization.
✔ Low Substrate Heating – Minimized thermal impact on sensitive materials.
✔ Compact Benchtop Design – Ideal for lab-scale thin-film research.
✔ Flexible Target Options – Supports Au, Ag, Pt, and other weakly magnetic materials.

Typical Applications:

· Semiconductors & Microelectronics – Conductive layers, MEMS, sensors.

· Optical Coatings – Reflective/anti-reflective films.

· Material Science – Nanostructured thin films, surface engineering.