High Vacuum Sputtering Metal Coating Machine Coater For Glovebox

High Vacuum Dual-Target Sputtering Coating Machine Coater For Glovebox

Model: TMAX-BY-JS05 – Product Specifications

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1. System Overview

The TMAX-BY-JS05 is a compact, benchtop magnetron sputtering system designed for high-performance thin-film deposition in research and laboratory environments. Featuring a dual-target configuration, it supports the deposition of single or multilayer functional films, including conductive, dielectric, optical, and hard coatings. The system combines high vacuum performance, precise process control, and user-friendly operation, making it ideal for material science, semiconductor research, and advanced coating development.

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2. Technical Specifications

2.1 General Parameters

Parameter	Specification
Model	TMAX-BY-JS05
Type	Benchtop Laboratory System
Dimensions (W×D×H)	610 × 420 × 490 mm
Weight	100 kg
Power Supply	AC 220V 50Hz / 110V 60Hz
Power Consumption	<3 kW
Cooling Method	Water-cooled (target) + Air-cooled (pump)
Warranty	1 year limited (lifetime support)

2.2 Vacuum System

Parameter	Specification
Pump Configuration	Rotary Pump (4.4 L/s) + Turbo Pump (300 L/s)
Base Pressure	≤5×10⁻⁵ Pa
Working Pressure	0.5–5 Pa
Pump-Down Time (to 10⁻³ Pa)	≤10 minutes
Vacuum Measurement	Full-range gauge (Atmosphere to 10⁻⁵ Pa)

2.3 Deposition System

Parameter	Specification
Target Configuration	Dual magnetron targets (independent control)
Target Size	Ø50 × 3 mm (standard: Cu & Al)
Target Materials	Metals, alloys, oxides, ceramics
Magnetic Compatibility	Weak magnetic materials supported
Deposition Rate	Adjustable (process-dependent)

2.4 Process Control

Parameter	Specification
Gas Flow Control	Mass flow controller (Ar/other inert gases)
Power Supply	DC: 0–600V, 0–1.6A; RF: 300W/500W (optional)
Thickness Monitoring	Real-time touchscreen control with 257 preloaded materials
Operation Interface	Dual-screen control system

2.5 Chamber & Substrate

Parameter	Specification
Chamber Material	Stainless steel
Chamber Dimensions	Outer: Ø260 × 500 mm; Inner: Ø210 × 270 mm
Substrate Holder	Customizable (max Ø200 mm)

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3. Key Features & Benefits

· Dual-Target Flexibility: Enables co-deposition or sequential layering of dissimilar materials (e.g., metal/oxide stacks).

· High Vacuum Performance: Achieves 5×10⁻⁵ Pa base pressure for contamination-free films.

· Precision Control: Touchscreen interface with real-time thickness monitoring and gas flow regulation.

· Compact Design: Optimized for small labs with limited space.

· Material Versatility: Supports metals, oxides, polymers, and magnetic materials.